High Density Interconnects (BGA, Flip Chip and
CSP Packages).
We offer ultra thin cores, fine line geometries and
alternative via techologies for enhanced thermal
transfer and the elimination of extensive routing
requirements.
Combining our strong comprehension of high
speed and RF package requirements together
with a "time critical" manufacturing response
allows ACL to play a significant role in both
evaluating a program's design parameters and
reducing its time to market equation.
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