ADVANCED COMPONENT LABS, INC.
	Capabilities
					LAMINATES  High Tg and BT resins Mitsubishi HL832 Rogers 4000 G200 Getek Neltec  Polyimide/Kapton films  Multi-function FR-4  Min Cladding ¼ oz  Max Cladding 2 oz  Min Core Thickness .05mm (.002) CONSTRUCTIONS  Controlled Dielectrics  Controlled Impedance  Differential Signals  Microstrip and stripline  Build Ups (to 12 Layers)  Blind Vias, Buried Vias  Flex .025mm (.001)  Conductive Hole Plug  “Via in Pad” for RF and High Density substrates DRILLING  Mechanical, Laser and Plasma  Min drill hole .025mm (.001) SURFACE FINISHES Wirebondable Structures  Differential Metalizations  Electrolytic/Electroless Processes  Full Body, Selective and Contact Gold  Immersion Silver LINE & SPACE  Min Line .025mm (.001)  Min Space .025mm (.001)  Finish Trace Tolerances +/-  ¼ oz Int 5%  1 oz Int 15% SOLDER MASK  Per IPC-SM-840  Taiyo and Conventional Epoxies  Liquid Photo-Imageable and Dry Films  “Flex” Mask MECHANICAL  Complete COC’s  Cross Section Analysis  Bondability assurance (pull strength and sigma analysis)  XRF Analysis  NIST Certified PREFERRED DATA  Gerber RS274X  DXF, DWG  AutoCAD  Email: acl1@aclusa.com ENGINEERING SOFTWARE Valor Genesis 2000 ELECTRICAL TEST  Flying Probe  HDI High Speed  Net List Comparison  AOI HEATSINK ATTACH  OFHC Copper or 6061-T6 Aluminum  Conductive adhesives with precision tolerances  Cavity Fabrications LABORATORY  Thermal Stress/Cross Sections  Dielectric Spacing Verification  Plating Process Controls
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							Wire Bondable Gold Specialist
						Quick Turn and Pre-production Manufacturing