ADVANCED COMPONENT LABS, INC.
About Us
Advanced Component Labs is the USA's leading fabricator of  "Time
Critical" High Density Interconnects.  With a sharp focus directed towards
the semiconductor packaging community; our Flip Chip, BGA, MCM, SIP
and organic interposer fabrications offer a perfect response to the market's
constantly increasing need for shorter lead times and improved device
performance.

We offer ultra thin cores, fine line geometries and alternative via
technologies for enhanced thermal transfer.  Our current process
capabilities include 20um circuit geometries, 30um dielectric layers, 50um
laser vias and 125um bump pitch processing.  These process capabilities
combined with a strong comprehension of high speed digital and high
frequency RF package requirements allows ACL to make a significant
impact in reducing a program's "time to market" equation.

By selecting ACL, you will be choosing a US manufacturing operation as
well as an organization with more than 30 years experience with the
fabrication of organic substrates.  We guarantee that your "time critical"
device will be delivered on time and fabricated precisely to your design
requirements.
Wire Bondable Gold Specialist
Quick Turn and Pre-production Fabrications
ITAR Approved Manufacturer
Wire Bondable Gold Specialist
Quick Turn and Pre-production Fabrications
ITAR Approved Manufacturer